Accueil » MV cables tools » CWB/12-44
CWB/12-44 - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback
Characteristics
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Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø12 - 44 mm
ø0.472 - 1.732 in -
To do what
The CWB/12-44 enables the user to remove the bonded semicon with a chamfer on the semiconductor cutback
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Product benefits
No silicon needed
Fine tuning of the blade with a 'click' for each 1/10 mm
Low roughness over insulation
No Clamp stoper needed
- Thickness capacity 1,8 mm / 0,071 in
- Angle of the chamfer on the semiconductor 13°
- Remaining length of the semiconductor 25mm / 0,984 in
- Certifications Approved by ENEDIS
Related kits
Available options
Complementary tools
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Spare Parts
LCWB-FEP-V - Spare blade for bonded semiconductor with chamfer 13° + screw
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